Packaging and characterization of orthogonal transfer array CCDs for the WIYN One Degree Imager

The WIYN One Degree Imager (ODI) will provide a one degree field of view for the WIYN 3.5 m telescope located on Kitt Peak near Tucson, Arizona. Its focal plane will consist of an 8×8 grid of Orthogonal Transfer Array (OTA) CCD detectors with nearly one billion pixels. The implementation of these detectors into the focal plane has required the development of several novel packaging and characterization techniques, which are the subject of this paper. We describe a new packaging/hybridization method in which the CCD die are directly bonded to aluminum nitride ceramic substrates which have indium bump on one side and brazed pins on the other. These custom packages allow good thermal conductivity, a flat imaging surface, four side buttability, and in situ testing of the devices during backside processing. We describe these carriers and the backside processing techniques used with them. We have also modified our cold probing system to screen these OTA die at wafer level to select the best candidates for backside processing. We describe these modifications and characterization results from several wafer lots.