OFC tutorial: III-V and silicon photonic integrated circuit technologies

Technologies can change rapidly and profoundly: Traditional drivers for photonic integration: Cost, size, power reduction for stable configurations (telelcom) Also opportunities/drivers where role changes to critical enabling technology Higher level modulation formats & coherent solutions, low-power transceivers/arrays; Si photonics will be increasingly powerful, but will still have to compete for a spot with high performance incumbent InP PIC technology But new markets & drivers on the horizon with potential for dramatic change in technology and market dynamics of photonic integration: Enabling the scaling of electronic functionality in client applications New requirements drives new performance metrics Need for ultra high density, ultra-low power, while maintaining high digital signal fidelity Need for unprecedented intimacy between photonics and electronics