Abstract
A formulation of the conjugate heat transfer in convective cooling of electronics is presented using the boundary element method. A general formulation for combining the fluid convection region and the solid conduction region is presented. The effects of upstream conduction on the component heat transfer, and the effects of substrate conductivity on the downstream thermal wake are presented. The fundamental issue of matching different equation types, elliptic in the solid, and parabolic in the fluid, is also briefly discussed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 31-39 |
| Number of pages | 9 |
| Journal | American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD |
| Volume | 299 |
| State | Published - 1994 |
| Event | Proceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA Duration: Nov 6 1994 → Nov 11 1994 |
ASJC Scopus subject areas
- Mechanical Engineering
- Fluid Flow and Transfer Processes