TY - GEN
T1 - Novel slurry injector device for chemical mechanical planarization
AU - Meled, Anand
AU - Borucki, Leonard
AU - Sampurno, Yasa
AU - Zhuang, Yun
AU - Theng, Sian
AU - Philipossian, Ara
PY - 2010
Y1 - 2010
N2 - This paper describes a novel slurry injector device for chemical mechanical planarization (CMP). The device exhibits superior properties compared to the standard pad center injection method as evidenced by: (1) improved slurry utilization, (2) minimal mixing of fresh slurry with water or old slurry, (3) higher removal rate at a given slurry flow rate, (4) same removal rate with significantly lower slurry consumption and (5) lower wafer-level defects.
AB - This paper describes a novel slurry injector device for chemical mechanical planarization (CMP). The device exhibits superior properties compared to the standard pad center injection method as evidenced by: (1) improved slurry utilization, (2) minimal mixing of fresh slurry with water or old slurry, (3) higher removal rate at a given slurry flow rate, (4) same removal rate with significantly lower slurry consumption and (5) lower wafer-level defects.
UR - http://www.scopus.com/inward/record.url?scp=79957633843&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79957633843&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:79957633843
SN - 9781617822810
T3 - Advanced Metallization Conference (AMC)
SP - 156
EP - 157
BT - Advanced Metallization Conference 2010
T2 - Advanced Metallization Conference 2010
Y2 - 5 October 2010 through 7 October 2010
ER -