Novel slurry injector device for chemical mechanical planarization

Anand Meled, Leonard Borucki, Yasa Sampurno, Yun Zhuang, Sian Theng, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper describes a novel slurry injector device for chemical mechanical planarization (CMP). The device exhibits superior properties compared to the standard pad center injection method as evidenced by: (1) improved slurry utilization, (2) minimal mixing of fresh slurry with water or old slurry, (3) higher removal rate at a given slurry flow rate, (4) same removal rate with significantly lower slurry consumption and (5) lower wafer-level defects.

Original languageEnglish (US)
Title of host publicationAdvanced Metallization Conference 2010
Number of pages2
StatePublished - 2010
Externally publishedYes
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: Oct 5 2010Oct 7 2010

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766


OtherAdvanced Metallization Conference 2010
Country/TerritoryUnited States
CityAlbany, NY

ASJC Scopus subject areas

  • General Materials Science
  • Industrial and Manufacturing Engineering


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