TY - GEN
T1 - Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP
AU - Zhuang, Yun
AU - Sampurno, Yasa
AU - Borucki, Leonard
AU - Philipossian, Ara
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2015/1/20
Y1 - 2015/1/20
N2 - In this study, a novel slurry injection system (SIS) is introduced. SIS is placed on top of the pad which conformally rides on the pad surface during polishing and presents a thin and uniform slurry film to the wafer. Examples of SIS installed on various 200 and 300 mm commercial polishers are shown. Removal rate and polishing defects are compared between SIS and the conventional pad center area slurry application method. Through more efficient slurry delivery and reduced slurry mixing and dilution, SIS has achieved more uniform slurry flow, higher material removal rate or the same removal rate with significantly lower slurry consumption, and lower number of wafer-level polishing defects than the conventional slurry application method.
AB - In this study, a novel slurry injection system (SIS) is introduced. SIS is placed on top of the pad which conformally rides on the pad surface during polishing and presents a thin and uniform slurry film to the wafer. Examples of SIS installed on various 200 and 300 mm commercial polishers are shown. Removal rate and polishing defects are compared between SIS and the conventional pad center area slurry application method. Through more efficient slurry delivery and reduced slurry mixing and dilution, SIS has achieved more uniform slurry flow, higher material removal rate or the same removal rate with significantly lower slurry consumption, and lower number of wafer-level polishing defects than the conventional slurry application method.
UR - http://www.scopus.com/inward/record.url?scp=84925378678&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84925378678&partnerID=8YFLogxK
U2 - 10.1109/ICPT.2014.7017242
DO - 10.1109/ICPT.2014.7017242
M3 - Conference contribution
AN - SCOPUS:84925378678
T3 - ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
SP - 45
EP - 49
BT - ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th International Conference on Planarization/CMP Technology, ICPT 2014
Y2 - 19 November 2014 through 21 November 2014
ER -