Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect

Junqiang Wu; Hao Xin

doi:10.1109/APUSNCURSINRSM.2017.8072661

Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect

Junqiang Wu, Hao Xin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

A novel antenna design that is enabled by 3D printing technology for future wireless intra-chip communications is proposed in this work. Vertical quarter-wavelength monopoles are used for intra-chip communication, which avoids substrate-caused low antenna radiation efficiency. The monopoles are surrounded by specially-designed dielectric distribution. This additional design degree of freedom allowed by 3D printing technology is used to tailor antenna radiation pattern that enhances the desired link and reduces the undesired crosstalk spatially. A 60 GHz prototype is designed, fabricated and measured. The measurement results agree well with the simulation results. The demonstrated path loss of the desired link at a distance of 17 mm is only 12 dB, which is more than 10 dB better than the theoretical value for 60 GHz monopoles based on Friis transmission equation and previously reported work.

Original language	English (US)
Title of host publication	2017 IEEE Antennas and Propagation Society International Symposium, Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1237-1238
Number of pages	2
ISBN (Electronic)	9781538632840
DOIs	https://doi.org/10.1109/APUSNCURSINRSM.2017.8072661
State	Published - Oct 18 2017
Event	2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, APSURSI 2017 - San Diego, United States Duration: Jul 9 2017 → Jul 14 2017

Publication series

Name	2017 IEEE Antennas and Propagation Society International Symposium, Proceedings
Volume	2017-January

Other

Other	2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, APSURSI 2017
Country/Territory	United States
City	San Diego
Period	7/9/17 → 7/14/17

Keywords

3D printing
Interconnect
Intra-chip communication
Monopole
Multiprocessor interconnection
Network on chip

ASJC Scopus subject areas

Radiation
Computer Networks and Communications
Instrumentation

Access to Document

10.1109/APUSNCURSINRSM.2017.8072661

Cite this

Wu, J., & Xin, H. (2017). Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect. In 2017 IEEE Antennas and Propagation Society International Symposium, Proceedings (pp. 1237-1238). (2017 IEEE Antennas and Propagation Society International Symposium, Proceedings; Vol. 2017-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APUSNCURSINRSM.2017.8072661

Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect. / Wu, Junqiang; Xin, Hao.
2017 IEEE Antennas and Propagation Society International Symposium, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1237-1238 (2017 IEEE Antennas and Propagation Society International Symposium, Proceedings; Vol. 2017-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Wu, J & Xin, H 2017, Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect. in 2017 IEEE Antennas and Propagation Society International Symposium, Proceedings. 2017 IEEE Antennas and Propagation Society International Symposium, Proceedings, vol. 2017-January, Institute of Electrical and Electronics Engineers Inc., pp. 1237-1238, 2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, APSURSI 2017, San Diego, United States, 7/9/17. https://doi.org/10.1109/APUSNCURSINRSM.2017.8072661

Wu J, Xin H. Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect. In 2017 IEEE Antennas and Propagation Society International Symposium, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1237-1238. (2017 IEEE Antennas and Propagation Society International Symposium, Proceedings). doi: 10.1109/APUSNCURSINRSM.2017.8072661

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abstract = "A novel antenna design that is enabled by 3D printing technology for future wireless intra-chip communications is proposed in this work. Vertical quarter-wavelength monopoles are used for intra-chip communication, which avoids substrate-caused low antenna radiation efficiency. The monopoles are surrounded by specially-designed dielectric distribution. This additional design degree of freedom allowed by 3D printing technology is used to tailor antenna radiation pattern that enhances the desired link and reduces the undesired crosstalk spatially. A 60 GHz prototype is designed, fabricated and measured. The measurement results agree well with the simulation results. The demonstrated path loss of the desired link at a distance of 17 mm is only 12 dB, which is more than 10 dB better than the theoretical value for 60 GHz monopoles based on Friis transmission equation and previously reported work.",

keywords = "3D printing, Interconnect, Intra-chip communication, Monopole, Multiprocessor interconnection, Network on chip",

author = "Junqiang Wu and Hao Xin",

note = "Funding Information: This work was supported in part by the National Science Foundation under award No. 1513923. Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, APSURSI 2017 ; Conference date: 09-07-2017 Through 14-07-2017",

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AB - A novel antenna design that is enabled by 3D printing technology for future wireless intra-chip communications is proposed in this work. Vertical quarter-wavelength monopoles are used for intra-chip communication, which avoids substrate-caused low antenna radiation efficiency. The monopoles are surrounded by specially-designed dielectric distribution. This additional design degree of freedom allowed by 3D printing technology is used to tailor antenna radiation pattern that enhances the desired link and reduces the undesired crosstalk spatially. A 60 GHz prototype is designed, fabricated and measured. The measurement results agree well with the simulation results. The demonstrated path loss of the desired link at a distance of 17 mm is only 12 dB, which is more than 10 dB better than the theoretical value for 60 GHz monopoles based on Friis transmission equation and previously reported work.

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Novel 3D-printing enabled antenna design for future wireless intra-chip interconnect

Abstract

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Keywords

ASJC Scopus subject areas

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