Abstract
A new simulation approach for embedded solid/gridded plane structures in LTCC circuits is proposed. Simulation and experimental results based on this approach for several solid/gridded benchmark structures are presented. The influence of the physical parameters of gridded planes on the electrical behavior of the plane structures is discussed.
Original language | English (US) |
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Pages (from-to) | 1413-1418 |
Number of pages | 6 |
Journal | Proceedings - Electronic Components and Technology Conference |
State | Published - 2003 |
Event | 53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: May 27 2003 → May 30 2003 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering