Abstract
Microchannel heat sinks with forced convective boiling can satisfy the increasing heat removal requirements of VLSI chips. But little is known about two-phase boiling flow in channels with cross-sectional dimensions below 100 μm. This work develops and experimentally verifies microchannel simulations, which relate the temperature field to the applied power and flowrate. The simulations consider silicon conduction and assume an immediate transition to homogeneous misty flow, without the bubbly and plug-flow regimes in larger channels. Pressure drop and wall temperature predictions are consistent with data for a channel with cross-sectional dimensions of 50 μm × 70 μm. The simulations explore the performance of a novel heat sink system with an electrokinetic pump for the liquid phase, which provides 1 atm and 15 ml/min. A temperature rise below 40 K is predicted for a 200 W heat sink for a 25 mm × 25 mm chip.
Original language | English (US) |
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Pages | 422-426 |
Number of pages | 5 |
State | Published - 2001 |
Externally published | Yes |
Event | 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland Duration: Jan 21 2001 → Jan 25 2001 |
Other
Other | 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) |
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Country/Territory | Switzerland |
City | Interlaken |
Period | 1/21/01 → 1/25/01 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Mechanical Engineering
- Electrical and Electronic Engineering