Buffered oxide etch (BOE) is used to remove oxide layers from wafer surfaces in the semiconductor industry. Measures are being introduced to reduce water usage in semiconductor fabrication. A study was conducted to examine the effects of process variables on wafer quality during etch processing in order to minimize the number of quick dump rinse (QDR) cycles and the initial rinse time. The required amount of water was a function of the wet etchant temperature. pH measurements could be used to minimize the initial overflow rinse time.
|Number of pages
|Published - May 2002
ASJC Scopus subject areas
- Water Science and Technology
- Fluid Flow and Transfer Processes