Microscale liquid impingement cooling

Lian Zhang; Evelyn N. Wang; Jon D. Koch; Jonathan T.C. Liu; Jae Mo Koo; Linan Jiang; Kenneth E. Goodson; Juan G. Santiago; Thomas W. Kenny

Microscale liquid impingement cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T.C. Liu, Jae Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny

Research output: Contribution to conference › Paper › peer-review

4 Scopus citations

Abstract

Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm² heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.

Original language	English (US)
Pages	2709-2714
Number of pages	6
State	Published - 2001
Externally published	Yes
Event	2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States Duration: Nov 11 2001 → Nov 16 2001

Conference

Conference	2001 ASME International Mechanical Engineering Congress and Exposition
Country/Territory	United States
City	New York, NY
Period	11/11/01 → 11/16/01

ASJC Scopus subject areas

General Engineering

Cite this

@conference{5209350fff45473b8929e3d3c1757985,

title = "Microscale liquid impingement cooling",

abstract = "Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm2 heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.",

author = "Lian Zhang and Wang, \{Evelyn N.\} and Koch, \{Jon D.\} and Liu, \{Jonathan T.C.\} and Koo, \{Jae Mo\} and Linan Jiang and Goodson, \{Kenneth E.\} and Santiago, \{Juan G.\} and Kenny, \{Thomas W.\}",

year = "2001",

language = "English (US)",

pages = "2709--2714",

note = "2001 ASME International Mechanical Engineering Congress and Exposition ; Conference date: 11-11-2001 Through 16-11-2001",

}

TY - CONF

T1 - Microscale liquid impingement cooling

AU - Zhang, Lian

AU - Wang, Evelyn N.

AU - Koch, Jon D.

AU - Liu, Jonathan T.C.

AU - Koo, Jae Mo

AU - Jiang, Linan

AU - Goodson, Kenneth E.

AU - Santiago, Juan G.

AU - Kenny, Thomas W.

PY - 2001

Y1 - 2001

N2 - Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm2 heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.

AB - Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm2 heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.

UR - https://www.scopus.com/pages/publications/1542516360

UR - https://www.scopus.com/inward/citedby.url?scp=1542516360&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:1542516360

SP - 2709

EP - 2714

T2 - 2001 ASME International Mechanical Engineering Congress and Exposition

Y2 - 11 November 2001 through 16 November 2001

ER -

Microscale liquid impingement cooling

Abstract

Conference

ASJC Scopus subject areas

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