Microscale liquid impingement cooling

Lian Zhang; Evelyn N. Wang; Jon D. Koch; Jonathan T.C. Liu; Jae Mo Koo; Linan Jiang; Kenneth E. Goodson; Juan G. Santiago; Thomas W. Kenny

Microscale liquid impingement cooling

Lian Zhang
, Evelyn N. Wang
, Jon D. Koch
, Jonathan T.C. Liu
, Jae Mo Koo
, Linan Jiang
, Kenneth E. Goodson
, Juan G. Santiago
, Thomas W. Kenny

Research output: Contribution to conference › Paper › peer-review

Abstract

Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm² heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.

Original language	English (US)
Pages	2709-2714
Number of pages	6
State	Published - 2001
Externally published	Yes
Event	2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States Duration: Nov 11 2001 → Nov 16 2001

Conference

Conference	2001 ASME International Mechanical Engineering Congress and Exposition
Country/Territory	United States
City	New York, NY
Period	11/11/01 → 11/16/01

ASJC Scopus subject areas

General Engineering

Cite this

@conference{5209350fff45473b8929e3d3c1757985,

title = "Microscale liquid impingement cooling",

abstract = "Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm2 heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.",

author = "Lian Zhang and Wang, \{Evelyn N.\} and Koch, \{Jon D.\} and Liu, \{Jonathan T.C.\} and Koo, \{Jae Mo\} and Linan Jiang and Goodson, \{Kenneth E.\} and Santiago, \{Juan G.\} and Kenny, \{Thomas W.\}",

year = "2001",

language = "English (US)",

pages = "2709--2714",

note = "2001 ASME International Mechanical Engineering Congress and Exposition ; Conference date: 11-11-2001 Through 16-11-2001",

}

TY - CONF

T1 - Microscale liquid impingement cooling

AU - Zhang, Lian

AU - Wang, Evelyn N.

AU - Koch, Jon D.

AU - Liu, Jonathan T.C.

AU - Koo, Jae Mo

AU - Jiang, Linan

AU - Goodson, Kenneth E.

AU - Santiago, Juan G.

AU - Kenny, Thomas W.

PY - 2001

Y1 - 2001

N2 - Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm2 heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.

AB - Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm2 heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.

UR - https://www.scopus.com/pages/publications/1542516360

UR - https://www.scopus.com/pages/publications/1542516360#tab=citedBy

M3 - Paper

AN - SCOPUS:1542516360

SP - 2709

EP - 2714

T2 - 2001 ASME International Mechanical Engineering Congress and Exposition

Y2 - 11 November 2001 through 16 November 2001

ER -

Microscale liquid impingement cooling

Abstract

Conference

ASJC Scopus subject areas

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