Microscale liquid impingement cooling

Lian Zhang, Evelyn N. Wang, Jon D. Koch, Jonathan T.C. Liu, Jae Mo Koo, Linan Jiang, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny

Research output: Contribution to conferencePaperpeer-review

5 Scopus citations


Impingement cooling is an attractive method for individual IC cooling because of the uniformity and high values of the expected heat transfer coefficient. This paper presents spatially-averaged temperature measurements for DI water impingement from single micro jets with diameters smaller than 50 μm. The jets are circular orifices plasma etched into silicon. A heater chip is fabricated to simulate a high power IC while simultaneously measuring the temperature distribution around the impingement region. A hydrodynamic model is proposed for determining the pressure drop associated with jet formation. With a single 50 μm diameter DI water jet at 3.5 ml/min flow rate, up to 45 W/cm 2 heat flux has been removed with 80°C chip temperature rise. This research provides the first study of microscale liquid impingement cooling down to 14 μm diameter jets.

Original languageEnglish (US)
Number of pages6
StatePublished - 2001
Externally publishedYes
Event2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States
Duration: Nov 11 2001Nov 16 2001


Other2001 ASME International Mechanical Engineering Congress and Exposition
Country/TerritoryUnited States
CityNew York, NY

ASJC Scopus subject areas

  • General Engineering


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