TY - GEN
T1 - MICRO-CHANNELS WITH SUSPENDED TEMPERATURE SENSORS FOR HEAT TRANSFER STUDY
AU - Jiang, Linan
AU - Wang, Yuelin
AU - Wong, Man
AU - Zohar, Yitshak
N1 - Publisher Copyright:
© 1999 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 1999
Y1 - 1999
N2 - A micro-system consisting of micro-channels with integrated temperature sensors was successfully designed and fabricated for the study of heat-transfer properties of fluid flow in micro-domains. Surface micro-machining technology was used to construct the micro-channels with dimensions of about 40μm × 1.4μm × 4000μm. Polysilicon thermistors, 4μm × 4μm × 0.4μm in size were suspended across the channels and directly exposed to the fluid for local temperature measurements. The micro-channels and the micro-sensors were calibrated prior to the heat-transfer studies. Experimental results of temperature distributions along a micro-channel are presented. The integrated micro-system performance was analyzed to provide a framework for the interpretation of the experimental data, and the various heat-transfer mechanisms are subsequently discussed.
AB - A micro-system consisting of micro-channels with integrated temperature sensors was successfully designed and fabricated for the study of heat-transfer properties of fluid flow in micro-domains. Surface micro-machining technology was used to construct the micro-channels with dimensions of about 40μm × 1.4μm × 4000μm. Polysilicon thermistors, 4μm × 4μm × 0.4μm in size were suspended across the channels and directly exposed to the fluid for local temperature measurements. The micro-channels and the micro-sensors were calibrated prior to the heat-transfer studies. Experimental results of temperature distributions along a micro-channel are presented. The integrated micro-system performance was analyzed to provide a framework for the interpretation of the experimental data, and the various heat-transfer mechanisms are subsequently discussed.
UR - http://www.scopus.com/inward/record.url?scp=85122672475&partnerID=8YFLogxK
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U2 - 10.1115/IMECE1999-0322
DO - 10.1115/IMECE1999-0322
M3 - Conference contribution
AN - SCOPUS:85122672475
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 567
EP - 573
BT - Micro-Electro-Mechanical Systems (MEMS)
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999
Y2 - 14 November 1999 through 19 November 1999
ER -