Method for ultra rapid determination of the lubrication mechanism in chemical mechanical planarization

Ruochen Han, Yasa Sampurno, Siannie Theng, Fransisca Sudargho, Yun Zhuang, Ara Philipossian

Research output: Contribution to journalArticlepeer-review

20 Scopus citations


In chemical mechanical planarization (CMP), Stribeck curves are normally constructed by plotting average coefficient of frictions (COF) against the average Sommerfeld number. Consequently, traditional Stribeck curves fail to provide a full explanation of the lubrication phenomena simply because COF and polishing downforce can fluctuate significantly due to stick-slip phenomena and transient instabilities caused by polishing kinematics and consumables. This study introduces a new method for rapidly generating an "improved" Stribeck curve (i.e. Stribeck+ curve) that shows a more complete tribological picture of the process. The method significantly reduces the consumables and time required to obtain the curve compared to traditional means. Results of the Stribeck+ curve are consistent with individual tests using several different consumables combinations. All copper CMP Stribeck+ examples clearly indicate the lubrication mechanism and transitions thereof between different polishing conditions. Variability in COF as well as a much wider range in v/P are also explored.

Original languageEnglish (US)
Pages (from-to)P32-P37
JournalECS Journal of Solid State Science and Technology
Issue number1
StatePublished - 2017


  • Chemical mechanical planarization
  • Coefficient of frictions
  • Lubrication mechanism
  • Stribeck+ curve

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials


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