Method for determining the lubrication mechanism of post-ILD CMP brush scrubbing

T. Sun; A. Philipossian

doi:10.1149/1.2929065

Method for determining the lubrication mechanism of post-ILD CMP brush scrubbing

T. Sun
, A. Philipossian

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

A method using spectral analysis of friction data is established to determine the tribological mechanism of post-interlevel dielectric (post-ILD) chemical mechanical planarization (CMP) brush scrubbing as a function of solution pH, pressure, and tool kinematics. Spectral analysis based on real-time raw friction data is used to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena. Friction force variance (2) criterion is established to determine the tribological mechanism during scrubbing, and compared to the classical method by constructing and interpreting Stribeck curves.

Original language	English (US)
Pages (from-to)	H214-H217
Journal	Electrochemical and Solid-State Letters
Volume	11
Issue number	8
DOIs	https://doi.org/10.1149/1.2929065
State	Published - 2008
Externally published	Yes

ASJC Scopus subject areas

General Chemical Engineering
General Materials Science
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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10.1149/1.2929065

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abstract = "A method using spectral analysis of friction data is established to determine the tribological mechanism of post-interlevel dielectric (post-ILD) chemical mechanical planarization (CMP) brush scrubbing as a function of solution pH, pressure, and tool kinematics. Spectral analysis based on real-time raw friction data is used to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena. Friction force variance (2) criterion is established to determine the tribological mechanism during scrubbing, and compared to the classical method by constructing and interpreting Stribeck curves.",

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AU - Philipossian, A.

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AB - A method using spectral analysis of friction data is established to determine the tribological mechanism of post-interlevel dielectric (post-ILD) chemical mechanical planarization (CMP) brush scrubbing as a function of solution pH, pressure, and tool kinematics. Spectral analysis based on real-time raw friction data is used to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena. Friction force variance (2) criterion is established to determine the tribological mechanism during scrubbing, and compared to the classical method by constructing and interpreting Stribeck curves.

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AN - SCOPUS:45249103297

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JO - Electrochemical and Solid-State Letters

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IS - 8

ER -

Method for determining the lubrication mechanism of post-ILD CMP brush scrubbing

Abstract

ASJC Scopus subject areas

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