A method using spectral analysis of friction data is established to determine the tribological mechanism of post-interlevel dielectric (post-ILD) chemical mechanical planarization (CMP) brush scrubbing as a function of solution pH, pressure, and tool kinematics. Spectral analysis based on real-time raw friction data is used to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena. Friction force variance (2) criterion is established to determine the tribological mechanism during scrubbing, and compared to the classical method by constructing and interpreting Stribeck curves.
ASJC Scopus subject areas
- Chemical Engineering(all)
- Materials Science(all)
- Physical and Theoretical Chemistry
- Electrical and Electronic Engineering