Abstract
A method using spectral analysis of friction data is established to determine the tribological mechanism of post-interlevel dielectric (post-ILD) chemical mechanical planarization (CMP) brush scrubbing as a function of solution pH, pressure, and tool kinematics. Spectral analysis based on real-time raw friction data is used to quantify the total amount of mechanical interaction in the brush-fluid-wafer interface in terms of stick-slip phenomena. Friction force variance (2) criterion is established to determine the tribological mechanism during scrubbing, and compared to the classical method by constructing and interpreting Stribeck curves.
Original language | English (US) |
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Pages (from-to) | H214-H217 |
Journal | Electrochemical and Solid-State Letters |
Volume | 11 |
Issue number | 8 |
DOIs | |
State | Published - 2008 |
ASJC Scopus subject areas
- Chemical Engineering(all)
- Materials Science(all)
- Physical and Theoretical Chemistry
- Electrochemistry
- Electrical and Electronic Engineering