TY - GEN
T1 - Metallic microactuators based on sacrificial layer SU8 release
AU - Enikov, Eniko T.
AU - Lazarov, Kalin V.
PY - 2003
Y1 - 2003
N2 - Thermal micro-actuators are a promising solution to the need for large-displacement, low-power MEMS actuators. Potential applications of these devices are micro-relays, tunable impedance RF networks, and miniature medical instrumentation. In this paper the development of thermal microactuators based on SU8 is described. A polymeric sacrificial layer allows the removal of the SU8 mold to occur without the use of harsh etching conditions. In addition to silicon non-traditional for MEMS substrates such as RF-printed circuit boards have also been successfully utilized to fabricate the devices. The PCB-based devices exhibited similar characteristics, thus opening the possibility of integrating RF MEMS directly on PCBs. The actuators were benchmarked with respect to power consumption, stroke, and response time. The fabricated nickel actuators are shown to be robust with displacements in the range of 76 micrometers using 80 mW of power. Actual cooling transients were captured using a two-step constant-current excitation method. It is further demonstrated through analytical models that the thermal cooling times limit the bandwidth of these devices below 1KHz. Several commercially relevant applications of the developed actuators are also discussed. One such application is a vibro-tactile display for disabled individuals.
AB - Thermal micro-actuators are a promising solution to the need for large-displacement, low-power MEMS actuators. Potential applications of these devices are micro-relays, tunable impedance RF networks, and miniature medical instrumentation. In this paper the development of thermal microactuators based on SU8 is described. A polymeric sacrificial layer allows the removal of the SU8 mold to occur without the use of harsh etching conditions. In addition to silicon non-traditional for MEMS substrates such as RF-printed circuit boards have also been successfully utilized to fabricate the devices. The PCB-based devices exhibited similar characteristics, thus opening the possibility of integrating RF MEMS directly on PCBs. The actuators were benchmarked with respect to power consumption, stroke, and response time. The fabricated nickel actuators are shown to be robust with displacements in the range of 76 micrometers using 80 mW of power. Actual cooling transients were captured using a two-step constant-current excitation method. It is further demonstrated through analytical models that the thermal cooling times limit the bandwidth of these devices below 1KHz. Several commercially relevant applications of the developed actuators are also discussed. One such application is a vibro-tactile display for disabled individuals.
UR - http://www.scopus.com/inward/record.url?scp=1942455831&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1942455831&partnerID=8YFLogxK
U2 - 10.1115/imece2003-43200
DO - 10.1115/imece2003-43200
M3 - Conference contribution
AN - SCOPUS:1942455831
SN - 0791837211
SN - 9780791837214
T3 - American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)
SP - 133
EP - 139
BT - Micro-Electro-Mechanical Systems (MEMS) - 2003
PB - American Society of Mechanical Engineers
T2 - 2003 ASME International Mechanical Engineering Congress
Y2 - 15 November 2003 through 21 November 2003
ER -