Abstract
The rapid development of reproductive biology has created a need for quantifying penetration forces during artificial fertilization. It has been demonstrated that the success of such procedures heavily depends on the mechanics of penetration of the egg's zona and membrane. To quantify the forces during intracytoplasmic injections we have developed a MEMS based force sensor. Deep RIE and fusion bonding are used to fabricate a variable capacitance type sensor. It is designed to measure the penetration force during intracytoplasmic injection of egg cells as well as other applications in the 1-500 μmN force range. The sensor measures tri-axial forces using a system of flexible beams subjected to bending and torsion. The process is relatively simple and allows for easy modification of the force range. A penetration pipette tip is attached to the sensor body using a low temperature bonding technique. Calibration, sensitivity and initial experimental data is provided.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 40-46 |
| Number of pages | 7 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3834 |
| State | Published - 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1999 Microbotics and Microassembly - Boston, MA, USA Duration: Sep 21 1999 → Sep 22 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering