TY - GEN
T1 - Measurements and modeling of two-phase flow in microchannels with nearly-constant heat flux boundary conditions
AU - Zhang, Lian
AU - Koo, Jae Mo
AU - Jiang, Linan
AU - Banerjee, Shilajeet S.
AU - Ashegi, Mehdi
AU - Goodson, Kenneth E.
AU - Santiago, Juan G.
AU - Kenny, Thomas W.
N1 - Funding Information:
This work is supported by DARPA HERETIC Program under DARPA Contract F33615-99-C-1442, and Stanford Graduate Fellowships (Lian Zhang, an A. Earl Cullum and Margaret Bennet Cullum Fellow). The project made use of the National Nanofabrication Users Network facilities funded by the National Science Foundation under award number ECS-9731294.
Publisher Copyright:
Copyright © 2000 by ASME
PY - 2000
Y1 - 2000
N2 - Two-phase forced convective flow in microchannels can be used as an effective means of cooling microelectronics. However, the number of studies on boiling in microchannels with dimensions smaller than 100 microns is limited. Particularly, the impact of small dimensions on bubble formation and the critical heat flux have received little attention. This work develops single and multi-channel silicon test devices with integrated heaters and thermometers, in an effort toward precisely determining the flow condition, the temperature distribution, and the heat transfer coefficients within microchannels. Rectangular channels with hydraulic diameter below 100 microns and varying aspect ratios were fabricated. The test devices have channel walls with widths below 350 microns, which minimizes solid conduction along the test section and reduces variations in the heat flux boundary condition. A semiconductor resistor strip measures the wall temperature distribution along the channel during phase change. A thermal resistance model has been developed to estimate the heat loss from the system. Down to hydraulic diameters as small as 25 microns, nucleation boiling under 5 °C of wall superheating was observed in plasma etched silicon microchannels.
AB - Two-phase forced convective flow in microchannels can be used as an effective means of cooling microelectronics. However, the number of studies on boiling in microchannels with dimensions smaller than 100 microns is limited. Particularly, the impact of small dimensions on bubble formation and the critical heat flux have received little attention. This work develops single and multi-channel silicon test devices with integrated heaters and thermometers, in an effort toward precisely determining the flow condition, the temperature distribution, and the heat transfer coefficients within microchannels. Rectangular channels with hydraulic diameter below 100 microns and varying aspect ratios were fabricated. The test devices have channel walls with widths below 350 microns, which minimizes solid conduction along the test section and reduces variations in the heat flux boundary condition. A semiconductor resistor strip measures the wall temperature distribution along the channel during phase change. A thermal resistance model has been developed to estimate the heat loss from the system. Down to hydraulic diameters as small as 25 microns, nucleation boiling under 5 °C of wall superheating was observed in plasma etched silicon microchannels.
UR - https://www.scopus.com/pages/publications/85119992549
UR - https://www.scopus.com/pages/publications/85119992549#tab=citedBy
U2 - 10.1115/IMECE2000-1082
DO - 10.1115/IMECE2000-1082
M3 - Conference contribution
AN - SCOPUS:85119992549
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 129
EP - 135
BT - Micro-Electro-Mechanical Systems (MEMS)
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Y2 - 5 November 2000 through 10 November 2000
ER -