TY - GEN
T1 - Measurement of Mid Spatial Frequencies of Diamond Turned Optics by using Dual-mode Snapshot Interferometry
AU - Khatri, Neha
AU - Manjunath, K.
AU - Tewary, Suman
AU - Kang, Wenjun
AU - Liang, Rongguang
N1 - Publisher Copyright:
© 2024 SPIE.
PY - 2024
Y1 - 2024
N2 - The measurement of mid-spatial frequency (MSF) in ultra-precision machining is crucial for assessing the quality and performance of machined surfaces. MSF refers to the frequency range of surface irregularities between low-frequency form errors and high-frequency roughness. The sources that contribute to MSF errors during diamond turning are vibrations and dynamic instabilities, tool wear and deflection during cutting, inconsistent feed rates, variation in material properties, incorrect machine settings/process parameters, material removal mechanism employed (e.g., ductile or brittle removal). Controlling & measuring mid-spatial frequencies in the diamond-turning process is essential for meeting stringent optical specifications in various applications, such as lens manufacturing for imaging systems, telescopes, laser systems, etc. Inspecting MSF errors offline or after the manufacturing process is a common practice in the quality control of optical surfaces. However, there is a growing interest in incorporating on-machine metrology to detect and address MSF errors. One of the latest developments is a dual-mode on-machine metrology (OMM) system that simultaneously measures surface form and roughness without requiring the optical path's reconfiguration to switch between laser interferometer mode and LED interference microscopy mode. This study uses OMM to study the influence of process parameters and their impact on the mid-spatial frequencies during diamond turning. OMM provides real-time feedback, which helps in adjusting machining parameters to correct deviations and maintain the desired mid-spatial frequencies.
AB - The measurement of mid-spatial frequency (MSF) in ultra-precision machining is crucial for assessing the quality and performance of machined surfaces. MSF refers to the frequency range of surface irregularities between low-frequency form errors and high-frequency roughness. The sources that contribute to MSF errors during diamond turning are vibrations and dynamic instabilities, tool wear and deflection during cutting, inconsistent feed rates, variation in material properties, incorrect machine settings/process parameters, material removal mechanism employed (e.g., ductile or brittle removal). Controlling & measuring mid-spatial frequencies in the diamond-turning process is essential for meeting stringent optical specifications in various applications, such as lens manufacturing for imaging systems, telescopes, laser systems, etc. Inspecting MSF errors offline or after the manufacturing process is a common practice in the quality control of optical surfaces. However, there is a growing interest in incorporating on-machine metrology to detect and address MSF errors. One of the latest developments is a dual-mode on-machine metrology (OMM) system that simultaneously measures surface form and roughness without requiring the optical path's reconfiguration to switch between laser interferometer mode and LED interference microscopy mode. This study uses OMM to study the influence of process parameters and their impact on the mid-spatial frequencies during diamond turning. OMM provides real-time feedback, which helps in adjusting machining parameters to correct deviations and maintain the desired mid-spatial frequencies.
KW - diamond turning
KW - Mid-spatial frequency errors
KW - on-machine metrology
KW - parameters optimization
UR - http://www.scopus.com/inward/record.url?scp=85207204463&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85207204463&partnerID=8YFLogxK
U2 - 10.1117/12.3027730
DO - 10.1117/12.3027730
M3 - Conference contribution
AN - SCOPUS:85207204463
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Optical Manufacturing and Testing 2024
A2 - Kim, Daewook
A2 - Choi, Heejoo
A2 - Ottevaere, Heidi
PB - SPIE
T2 - Optical Manufacturing and Testing 2024
Y2 - 20 August 2024 through 22 August 2024
ER -