Abstract
As the worldwide manufacture of semiconductors continues to grow, the semiconductor industry needs increasing amounts of ultrapure water. This water, used to physically wash the surface of silicon wafers to remove process contamination, has become a vital part of manufacturing an integrated circuit. The combined use of water purification techniques such as ion exchange, reverse osmosis, filtration, and ultraviolet (UV) sterilization, and other technologies have enabled the semiconductor industry to become the world's largest user of ultrapure water. The presence of silica in high purity water can be particularly detrimental to the manufacture of semiconductors on the surface of a single crystal of silicon. Unfortunately silicon is one of earth's most abundant elements and easily finds its way into all water supplies. The colloidal form of silica is particularly difficult to remove and detect. This paper reviews the different silica measurement procedures available and presents a new method for dissolving colloidal silica using an ultraviolet/ozone technique.
| Original language | English (US) |
|---|---|
| Pages | 43-58 |
| Number of pages | 16 |
| State | Published - 1997 |
| Event | Proceedings of the 1997 16th Annual Semiconductor Pure Water and Chemicals, SPWCC. Part 2 (of 2) - Santa Clara, CA, USA Duration: Mar 3 1997 → Mar 7 1997 |
Other
| Other | Proceedings of the 1997 16th Annual Semiconductor Pure Water and Chemicals, SPWCC. Part 2 (of 2) |
|---|---|
| City | Santa Clara, CA, USA |
| Period | 3/3/97 → 3/7/97 |
ASJC Scopus subject areas
- Water Science and Technology
- Electronic, Optical and Magnetic Materials