Manufacturing High-Q Silicon Nitride Photonic Chips via Silicon Hardmask Etching

Shuai Liu; Yuheng Zhang; Zheshen Zhang

Manufacturing High-Q Silicon Nitride Photonic Chips via Silicon Hardmask Etching

Shuai Liu, Yuheng Zhang, Zheshen Zhang

Research output: Contribution to conference › Paper › peer-review

Abstract

We present a robust process for fabricating high-Q, dispersion-engineered Si₃N₄ photonic chips using amorphous silicon hardmask etching with PECVD SiO₂ cladding, achieving an intrinsic quality factor up to ∼ 17.5×10⁶ and an average intrinsic quality factor of ∼ 13×10⁶. We anticipate a further reduction in propagation loss through LPCVD SiO₂ cladding.

Original language	English (US)
State	Published - 2024
Externally published	Yes
Event	CLEO: Science and Innovations in CLEO 2024, CLEO: S and I 2024 - Part of Conference on Lasers and Electro-Optics - Charlotte, United States Duration: May 5 2024 → May 10 2024

Conference

Conference	CLEO: Science and Innovations in CLEO 2024, CLEO: S and I 2024 - Part of Conference on Lasers and Electro-Optics
Country/Territory	United States
City	Charlotte
Period	5/5/24 → 5/10/24

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
General Computer Science
Space and Planetary Science
Control and Systems Engineering
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation

Cite this

@conference{f881c2aa27b044e8b3b0316bba8d97bb,

title = "Manufacturing High-Q Silicon Nitride Photonic Chips via Silicon Hardmask Etching",

abstract = "We present a robust process for fabricating high-Q, dispersion-engineered Si3N4 photonic chips using amorphous silicon hardmask etching with PECVD SiO2 cladding, achieving an intrinsic quality factor up to ∼ 17.5×106 and an average intrinsic quality factor of ∼ 13×106. We anticipate a further reduction in propagation loss through LPCVD SiO2 cladding.",

author = "Shuai Liu and Yuheng Zhang and Zheshen Zhang",

note = "Publisher Copyright: {\textcopyright} Optica Publishing Group 2024; CLEO: Science and Innovations in CLEO 2024, CLEO: S and I 2024 - Part of Conference on Lasers and Electro-Optics ; Conference date: 05-05-2024 Through 10-05-2024",

year = "2024",

language = "English (US)",

}

TY - CONF

T1 - Manufacturing High-Q Silicon Nitride Photonic Chips via Silicon Hardmask Etching

AU - Liu, Shuai

AU - Zhang, Yuheng

AU - Zhang, Zheshen

PY - 2024

Y1 - 2024

N2 - We present a robust process for fabricating high-Q, dispersion-engineered Si3N4 photonic chips using amorphous silicon hardmask etching with PECVD SiO2 cladding, achieving an intrinsic quality factor up to ∼ 17.5×106 and an average intrinsic quality factor of ∼ 13×106. We anticipate a further reduction in propagation loss through LPCVD SiO2 cladding.

AB - We present a robust process for fabricating high-Q, dispersion-engineered Si3N4 photonic chips using amorphous silicon hardmask etching with PECVD SiO2 cladding, achieving an intrinsic quality factor up to ∼ 17.5×106 and an average intrinsic quality factor of ∼ 13×106. We anticipate a further reduction in propagation loss through LPCVD SiO2 cladding.

UR - https://www.scopus.com/pages/publications/85205114873

UR - https://www.scopus.com/inward/citedby.url?scp=85205114873&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:85205114873

T2 - CLEO: Science and Innovations in CLEO 2024, CLEO: S and I 2024 - Part of Conference on Lasers and Electro-Optics

Y2 - 5 May 2024 through 10 May 2024

ER -

Manufacturing High-Q Silicon Nitride Photonic Chips via Silicon Hardmask Etching

Abstract

Conference

ASJC Scopus subject areas

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