Manufacturing High-Q Silicon Nitride Photonic Chips via Silicon Hardmask Etching

Shuai Liu, Yuheng Zhang, Zheshen Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

We present a robust process for fabricating high-Q, dispersion-engineered Si3N4 photonic chips using amorphous silicon hardmask etching with PECVD SiO2 cladding, achieving an intrinsic quality factor up to ∼ 17.5×106 and an average intrinsic quality factor of ∼ 13×106. We anticipate a further reduction in propagation loss through LPCVD SiO2 cladding.

Original languageEnglish (US)
Title of host publication2024 Conference on Lasers and Electro-Optics, CLEO 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781957171395
DOIs
StatePublished - 2024
Externally publishedYes
Event2024 Conference on Lasers and Electro-Optics, CLEO 2024 - Charlotte, United States
Duration: May 7 2024May 10 2024

Publication series

Name2024 Conference on Lasers and Electro-Optics, CLEO 2024

Conference

Conference2024 Conference on Lasers and Electro-Optics, CLEO 2024
Country/TerritoryUnited States
CityCharlotte
Period5/7/245/10/24

Keywords

  • Amorphous silicon
  • Claddings
  • Electro-optical waveguides
  • Etching
  • Manufacturing
  • Photonics
  • Propagation losses
  • Q-factor
  • Silicon nitride

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Computer Networks and Communications
  • Civil and Structural Engineering
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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