Low-power, parallel photonic interconnections for multi-chip module applications

R. F. Carson, M. L. Lovejoy, K. L. Lear, M. E. Warren, O. Blum, S. P. Kilcoyne, T. Du, P. K. Seigal, D. C. Craft, B. H. Rose

Research output: Contribution to journalConference articlepeer-review

3 Scopus citations


New applications of photonic interconnects will involve the insertion of parallel-channel links into Multi-Chip Modules (MCMs). Such applications will drive photonic link components into more compact forms that consume far less power than traditional telecommunication data links. MCM-based applications will also require simplified drive circuitry, lower cost, and higher reliability than has been demonstrated currently in photonic and optoelectronic technologies. The work described is a parallel link array, designed for vertical (Z-Axis) interconnection of the layers in a MCM-based signal processor stack, operating at a data rate of 100 Mb/s. This interconnect is based upon high-efficiency VCSELs, HBT photoreceivers, integrated micro-optics, and MCM-compatible packaging techniques.

Original languageEnglish (US)
Pages (from-to)380-386
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 1995
Externally publishedYes
EventProceedings of the 1995 45th Electronic Components & Technology Conference - Las Vegas, NV, USA
Duration: May 21 1995May 24 1995

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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