Low-power multichip module and board-level links for data transfer

Richard F. Carson, Terry L. Hardin, Mial E. Warren, Kevin L. Lear, Michael L. Lovejoy, Pamela K. Seigal, David C. Craft, Paul J. Enquist

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Advanced device technologies such as vertical cavity surface emitting lasers (VCSELs) and diffractive micro lenses can be combined with novel packaging techniques to allow low-power interconnection of parallel optical signals. These interconnections can be realized directly on circuit boards, in a multi-chip module format, or in packages that emulate electrical connectors. For applications such as stacking of multi-chip module (MCM) layers, the links may be realized in bi-directional form using integrated diffractive microlenses. In the stacked MCM design, consumed electrical power is minimized by use of a relatively high laser output from high efficiency VCSELs, and a receiver design that is optimized for low power, at the expense of dynamic range. WIthin certain constraints, the design may be extended to other forms such as board-level interconnects.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsRay T. Chen, Peter S. Guilfoyle
PublisherSociety of Photo-Optical Instrumentation Engineers
Number of pages11
ISBN (Print)0819424161
StatePublished - 1997
Externally publishedYes
EventOptoelectronic Interconnects and Packaging IV - San Jose, CA, USA
Duration: Feb 12 1997Feb 14 1997

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherOptoelectronic Interconnects and Packaging IV
CitySan Jose, CA, USA

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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