Low-power modular parallel photonic data links

R. F. Carson, M. L. Lovejoy, K. L. Lear, M. E. Warren, P. K. Seigal, G. A. Patrizi, S. P. Kilcoyne, D. C. Craft

Research output: Contribution to journalConference articlepeer-review

4 Scopus citations


Many of the potential applications for parallel photonic data links could benefit from a bi-directional Optoelectronic Multi-Chip Module (OEMCM), where the optical transmitter, receiver, and first-level interface electronics are combined into a single package. It would be desirable for such a module to exhibit low power consumption, have a simple electronic interface that can operate at a variety of speeds, and possess a capability to use interchangeable optics for a variety of external connections. Here, we describe initial results for a parallel photonic link technology that exhibits those properties. This link uses high-efficiency, back-emitting, two-dimensional Vertical Cavity Surface-Emitting Laser (VCSEL) arrays operating at 980 nm. The lasers are matched, via integrated microlenses, to corresponding monolithically-integrated photoreceiver arrays that are constructed in a InGaAs/InP Heterojunction Bipolar Transistor (HBT) technology. In initial breadboard-level tests, the photonic data channels built with these devices have been demonstrated with direct (3.3 V) CMOS drive of the VCSELs and a corresponding CMOS interface at the photoreceiver outputs. These links have shown electrical power consumption as low as 42 mW per channel for a 50% average duty cycle while operating at 100 Mb/s.

Original languageEnglish (US)
Pages (from-to)321-326
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 1996
Externally publishedYes
EventProceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC - Orlando, FL, USA
Duration: May 28 1996May 31 1996

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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