Laser tilt measurements of a slurry injection system

Leonard Borucki, Yasa Sampurno, Yun Zhuang, Sian Theng, Changhong Wu, Ara Philipossian

Research output: Contribution to journalArticlepeer-review


In this paper, we describe a method that we have developed for studying the behavior of a novel slurry injection system (SIS) during polishing. The method uses sensitive laser measurements and automated image analysis to infer the pitch of the injector body as a function of time under various conditions on a research polisher. The measurements clearly show the pitch response of the injector during typical CMP processing steps, such as pad rinsing and wafer polishing. Changes in pitch behavior as a function of injector design and operation, in combination with removal rate measurements, suggest explanations for the removal rate behavior of the device.

Original languageEnglish (US)
Pages (from-to)P5021-P5024
JournalECS Journal of Solid State Science and Technology
Issue number11
StatePublished - 2015

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials


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