Laser tilt measurements of a slurry injection system

Leonard Borucki; Yasa Sampurno; Yun Zhuang; Sian Theng; Changhong Wu; Ara Philipossian

doi:10.1149/2.0041511jss

Laser tilt measurements of a slurry injection system

Leonard Borucki, Yasa Sampurno, Yun Zhuang, Sian Theng, Changhong Wu, Ara Philipossian

Chemical and Environmental Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper, we describe a method that we have developed for studying the behavior of a novel slurry injection system (SIS) during polishing. The method uses sensitive laser measurements and automated image analysis to infer the pitch of the injector body as a function of time under various conditions on a research polisher. The measurements clearly show the pitch response of the injector during typical CMP processing steps, such as pad rinsing and wafer polishing. Changes in pitch behavior as a function of injector design and operation, in combination with removal rate measurements, suggest explanations for the removal rate behavior of the device.

Original language	English (US)
Pages (from-to)	P5021-P5024
Journal	ECS Journal of Solid State Science and Technology
Volume	4
Issue number	11
DOIs	https://doi.org/10.1149/2.0041511jss
State	Published - 2015

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

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title = "Laser tilt measurements of a slurry injection system",

abstract = "In this paper, we describe a method that we have developed for studying the behavior of a novel slurry injection system (SIS) during polishing. The method uses sensitive laser measurements and automated image analysis to infer the pitch of the injector body as a function of time under various conditions on a research polisher. The measurements clearly show the pitch response of the injector during typical CMP processing steps, such as pad rinsing and wafer polishing. Changes in pitch behavior as a function of injector design and operation, in combination with removal rate measurements, suggest explanations for the removal rate behavior of the device.",

author = "Leonard Borucki and Yasa Sampurno and Yun Zhuang and Sian Theng and Changhong Wu and Ara Philipossian",

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T1 - Laser tilt measurements of a slurry injection system

AU - Borucki, Leonard

AU - Sampurno, Yasa

AU - Zhuang, Yun

AU - Theng, Sian

AU - Wu, Changhong

AU - Philipossian, Ara

PY - 2015

Y1 - 2015

N2 - In this paper, we describe a method that we have developed for studying the behavior of a novel slurry injection system (SIS) during polishing. The method uses sensitive laser measurements and automated image analysis to infer the pitch of the injector body as a function of time under various conditions on a research polisher. The measurements clearly show the pitch response of the injector during typical CMP processing steps, such as pad rinsing and wafer polishing. Changes in pitch behavior as a function of injector design and operation, in combination with removal rate measurements, suggest explanations for the removal rate behavior of the device.

AB - In this paper, we describe a method that we have developed for studying the behavior of a novel slurry injection system (SIS) during polishing. The method uses sensitive laser measurements and automated image analysis to infer the pitch of the injector body as a function of time under various conditions on a research polisher. The measurements clearly show the pitch response of the injector during typical CMP processing steps, such as pad rinsing and wafer polishing. Changes in pitch behavior as a function of injector design and operation, in combination with removal rate measurements, suggest explanations for the removal rate behavior of the device.

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JF - ECS Journal of Solid State Science and Technology

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Laser tilt measurements of a slurry injection system

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