Investigations of solution variables in a contactless copper electrodeposition process for 3D packaging applications

C. Weber, Z. Patterson, M. Zhao, R. Balachandran, R. Gouk, S. Verhaverbeke, F. Shadman, Manish K Keswani

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

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Keyphrases

Material Science

Chemical Engineering

Engineering