Investigating effect of conditioner aggressiveness on removal rate during interlayer dielectric chemical mechanical planarization through confocal microscopy and dual emission ultraviolet-enhanced fluorescence imaging

Ting Sun, Len Borucki, Yun Zhuang, Yasa Sampurno, Fransisca Sudargho, Xiaomin Wei, Sriram Anjur, Ara Philipossian

Research output: Contribution to journal › Article › peer-review

32 Scopus citations

Fingerprint

Dive into the research topics of 'Investigating effect of conditioner aggressiveness on removal rate during interlayer dielectric chemical mechanical planarization through confocal microscopy and dual emission ultraviolet-enhanced fluorescence imaging'. Together they form a unique fingerprint.

Material Science

Keyphrases

Engineering