Interconnect simulation based on passivity and method of characteristics

E. S. Kuh; J. F. Mao; M. L. Wang

Interconnect simulation based on passivity and method of characteristics

E. S. Kuh, J. F. Mao, M. L. Wang

Electrical and Computer Engineering

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging.

Original language	English (US)
Pages	449-457
Number of pages	9
State	Published - 1996
Event	Proceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems - Seoul, South Korea Duration: Nov 18 1996 → Nov 21 1996

Other

Other	Proceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems
City	Seoul, South Korea
Period	11/18/96 → 11/21/96

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@conference{eb3dd41efbbd47c48dfcafd0421ca5de,

title = "Interconnect simulation based on passivity and method of characteristics",

abstract = "Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging.",

author = "Kuh, {E. S.} and Mao, {J. F.} and Wang, {M. L.}",

year = "1996",

language = "English (US)",

pages = "449--457",

note = "Proceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems ; Conference date: 18-11-1996 Through 21-11-1996",

}

TY - CONF

T1 - Interconnect simulation based on passivity and method of characteristics

AU - Kuh, E. S.

AU - Mao, J. F.

AU - Wang, M. L.

PY - 1996

Y1 - 1996

N2 - Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging.

AB - Interconnect analysis modeling, and simulation will play a major role in the future design of submicron IC and electronic packaging. Existing simulation methods by and large depend on convolution and the well-known Pade approximation of transcendental functions which characterize transmission lines. Unfortunately, Pade approximation does not guarantee stability. In this paper two methods are presented. One is based on using the concept of passivity, and the other uses the traditional method of characteristics. Preliminary results obtained on simple examples are very encouraging.

UR - http://www.scopus.com/inward/record.url?scp=0030399409&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0030399409&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0030399409

SP - 449

EP - 457

T2 - Proceedings of the 1996 IEEE Asia Pacific Conference on Circuits and Systems

Y2 - 18 November 1996 through 21 November 1996

ER -

Interconnect simulation based on passivity and method of characteristics

Abstract

Other

ASJC Scopus subject areas

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