Interaction between Ceria and Hydroxylamine

Subramanian Tamilmani; Jilei Shan; Wayne Huang; Srini Raghavan; Robert Small; Cass Shang; Brandon Scott

doi:10.1557/proc-767-f3.3

Interaction between Ceria and Hydroxylamine

Subramanian Tamilmani, Jilei Shan, Wayne Huang, Srini Raghavan, Robert Small, Cass Shang, Brandon Scott

Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

5 Scopus citations

Abstract

Ceria containing slurries are increasingly used in the chemical mechanical polishing of CVD silicon oxide films to obtain STI structures. Unlike silica or alumina, ceria has redox characteristics. Because of this characteristic, removal of ceria particles from planarized surfaces may be possible using chemical reagents that can participate in redox reactions. One such reagent is hydroxylamine, which is already being used in copper CMP. The objective of the work reported in this paper was to characterize the reaction between ceria and hydroxylamine, especially with respect to dissolution of ceria particles. A kinetic study of the dissolution of ceria in hydroxylamine solutions maintained at various pH values has been performed. The extent and kinetics of dissolution of ceria has been determined by ICPMS. Removal of ceria particles from oxide surfaces using hydroxylamine-based chemistries has been investigated.

Original language	English (US)
Pages (from-to)	161-166
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	767
DOIs	https://doi.org/10.1557/proc-767-f3.3
State	Published - 2003
Event	Chemical-Mechanical Planarization - San Francisco, CA, United States Duration: Apr 22 2003 → Apr 24 2003

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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title = "Interaction between Ceria and Hydroxylamine",

abstract = "Ceria containing slurries are increasingly used in the chemical mechanical polishing of CVD silicon oxide films to obtain STI structures. Unlike silica or alumina, ceria has redox characteristics. Because of this characteristic, removal of ceria particles from planarized surfaces may be possible using chemical reagents that can participate in redox reactions. One such reagent is hydroxylamine, which is already being used in copper CMP. The objective of the work reported in this paper was to characterize the reaction between ceria and hydroxylamine, especially with respect to dissolution of ceria particles. A kinetic study of the dissolution of ceria in hydroxylamine solutions maintained at various pH values has been performed. The extent and kinetics of dissolution of ceria has been determined by ICPMS. Removal of ceria particles from oxide surfaces using hydroxylamine-based chemistries has been investigated.",

author = "Subramanian Tamilmani and Jilei Shan and Wayne Huang and Srini Raghavan and Robert Small and Cass Shang and Brandon Scott",

year = "2003",

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pages = "161--166",

journal = "Materials Research Society Symposium - Proceedings",

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note = "Chemical-Mechanical Planarization ; Conference date: 22-04-2003 Through 24-04-2003",

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TY - JOUR

T1 - Interaction between Ceria and Hydroxylamine

AU - Tamilmani, Subramanian

AU - Shan, Jilei

AU - Huang, Wayne

AU - Raghavan, Srini

AU - Small, Robert

AU - Shang, Cass

AU - Scott, Brandon

PY - 2003

Y1 - 2003

N2 - Ceria containing slurries are increasingly used in the chemical mechanical polishing of CVD silicon oxide films to obtain STI structures. Unlike silica or alumina, ceria has redox characteristics. Because of this characteristic, removal of ceria particles from planarized surfaces may be possible using chemical reagents that can participate in redox reactions. One such reagent is hydroxylamine, which is already being used in copper CMP. The objective of the work reported in this paper was to characterize the reaction between ceria and hydroxylamine, especially with respect to dissolution of ceria particles. A kinetic study of the dissolution of ceria in hydroxylamine solutions maintained at various pH values has been performed. The extent and kinetics of dissolution of ceria has been determined by ICPMS. Removal of ceria particles from oxide surfaces using hydroxylamine-based chemistries has been investigated.

AB - Ceria containing slurries are increasingly used in the chemical mechanical polishing of CVD silicon oxide films to obtain STI structures. Unlike silica or alumina, ceria has redox characteristics. Because of this characteristic, removal of ceria particles from planarized surfaces may be possible using chemical reagents that can participate in redox reactions. One such reagent is hydroxylamine, which is already being used in copper CMP. The objective of the work reported in this paper was to characterize the reaction between ceria and hydroxylamine, especially with respect to dissolution of ceria particles. A kinetic study of the dissolution of ceria in hydroxylamine solutions maintained at various pH values has been performed. The extent and kinetics of dissolution of ceria has been determined by ICPMS. Removal of ceria particles from oxide surfaces using hydroxylamine-based chemistries has been investigated.

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DO - 10.1557/proc-767-f3.3

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AN - SCOPUS:0242290997

SN - 0272-9172

VL - 767

SP - 161

EP - 166

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Chemical-Mechanical Planarization

Y2 - 22 April 2003 through 24 April 2003

ER -

Interaction between Ceria and Hydroxylamine

Abstract

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