Integration of surface micromachined devices with optoelectronics: Technology and applications

M. E. Warren, O. Blum, C. T. Sullivan, R. J. Shul, M. S. Rodgers, J. J. Sniegowski

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations


The integration of microelectromechanical systems (MEMS) and optoelectronic of photonic functions and the fabrication constraints on both system components are described. The MEMS technology used in this work are silicon surface-machined systems fabricated using the Sandia Ultraplanar Multilevel MEMS Technology (SUMMiT) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.

Original languageEnglish (US)
Pages (from-to)3-4
Number of pages2
JournalLEOS Summer Topical Meeting
StatePublished - 1998
Externally publishedYes
EventProceedings of the 1998 IEEE/LEOS Summer Topical Meeting - Monterey, CA, USA
Duration: Jul 20 1998Jul 24 1998

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering


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