Integration of surface micromachined devices with optoelectronics: Technology and applications

M. E. Warren; O. Blum; C. T. Sullivan; R. J. Shul; M. S. Rodgers; J. J. Sniegowski

Integration of surface micromachined devices with optoelectronics: Technology and applications

M. E. Warren, O. Blum, C. T. Sullivan, R. J. Shul, M. S. Rodgers, J. J. Sniegowski

Research output: Contribution to journal › Conference article › peer-review

Abstract

The integration of microelectromechanical systems (MEMS) and optoelectronic of photonic functions and the fabrication constraints on both system components are described. The MEMS technology used in this work are silicon surface-machined systems fabricated using the Sandia Ultraplanar Multilevel MEMS Technology (SUMMiT) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.

Original language	English (US)
Pages (from-to)	3-4
Number of pages	2
Journal	LEOS Summer Topical Meeting
State	Published - 1998
Externally published	Yes
Event	Proceedings of the 1998 IEEE/LEOS Summer Topical Meeting - Monterey, CA, USA Duration: Jul 20 1998 → Jul 24 1998

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

Cite this

@article{7a92d34269874646bd481504e25426d6,

title = "Integration of surface micromachined devices with optoelectronics: Technology and applications",

abstract = "The integration of microelectromechanical systems (MEMS) and optoelectronic of photonic functions and the fabrication constraints on both system components are described. The MEMS technology used in this work are silicon surface-machined systems fabricated using the Sandia Ultraplanar Multilevel MEMS Technology (SUMMiT) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.",

author = "Warren, {M. E.} and O. Blum and Sullivan, {C. T.} and Shul, {R. J.} and Rodgers, {M. S.} and Sniegowski, {J. J.}",

year = "1998",

language = "English (US)",

pages = "3--4",

journal = "LEOS Summer Topical Meeting",

issn = "1099-4742",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1998 IEEE/LEOS Summer Topical Meeting ; Conference date: 20-07-1998 Through 24-07-1998",

}

TY - JOUR

T1 - Integration of surface micromachined devices with optoelectronics

T2 - Proceedings of the 1998 IEEE/LEOS Summer Topical Meeting

AU - Warren, M. E.

AU - Blum, O.

AU - Sullivan, C. T.

AU - Shul, R. J.

AU - Rodgers, M. S.

AU - Sniegowski, J. J.

PY - 1998

Y1 - 1998

N2 - The integration of microelectromechanical systems (MEMS) and optoelectronic of photonic functions and the fabrication constraints on both system components are described. The MEMS technology used in this work are silicon surface-machined systems fabricated using the Sandia Ultraplanar Multilevel MEMS Technology (SUMMiT) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.

AB - The integration of microelectromechanical systems (MEMS) and optoelectronic of photonic functions and the fabrication constraints on both system components are described. The MEMS technology used in this work are silicon surface-machined systems fabricated using the Sandia Ultraplanar Multilevel MEMS Technology (SUMMiT) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.

UR - http://www.scopus.com/inward/record.url?scp=0031629132&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031629132&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0031629132

SN - 1099-4742

SP - 3

EP - 4

JO - LEOS Summer Topical Meeting

JF - LEOS Summer Topical Meeting

Y2 - 20 July 1998 through 24 July 1998

ER -

Integration of surface micromachined devices with optoelectronics: Technology and applications

Abstract

ASJC Scopus subject areas

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