Integrated system for design automation of VLSI interconnects and packaging

P. Hsu; J. W. Rozenblit; S. N. Pratapneni; C. M. Wolff; J. L. Prince

Integrated system for design automation of VLSI interconnects and packaging

P. Hsu, J. W. Rozenblit, S. N. Pratapneni, C. M. Wolff, J. L. Prince

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing importance with higher circuit integration and system performance. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, CAD framework development and evaluations for performance, manufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system in development, its implementation and applications.

Original language	English (US)
Title of host publication	Midwest Symposium on Circuits and Systems
Publisher	Publ by IEEE
Pages	847-850
Number of pages	4
ISBN (Print)	0780317610
State	Published - 1993
Event	Proceedings of the 36th Midwest Symposium on Circuits and Systems - Detroit, MI, USA Duration: Aug 16 1993 → Aug 18 1993

Publication series

Name	Midwest Symposium on Circuits and Systems
Volume	2

Other

Other	Proceedings of the 36th Midwest Symposium on Circuits and Systems
City	Detroit, MI, USA
Period	8/16/93 → 8/18/93

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

@inproceedings{b8e1cc63adec430e8d90a7f07bdcb75e,

title = "Integrated system for design automation of VLSI interconnects and packaging",

abstract = "The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing importance with higher circuit integration and system performance. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, CAD framework development and evaluations for performance, manufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system in development, its implementation and applications.",

author = "P. Hsu and Rozenblit, {J. W.} and Pratapneni, {S. N.} and Wolff, {C. M.} and Prince, {J. L.}",

year = "1993",

language = "English (US)",

isbn = "0780317610",

series = "Midwest Symposium on Circuits and Systems",

publisher = "Publ by IEEE",

pages = "847--850",

booktitle = "Midwest Symposium on Circuits and Systems",

note = "Proceedings of the 36th Midwest Symposium on Circuits and Systems ; Conference date: 16-08-1993 Through 18-08-1993",

}

TY - GEN

T1 - Integrated system for design automation of VLSI interconnects and packaging

AU - Hsu, P.

AU - Rozenblit, J. W.

AU - Pratapneni, S. N.

AU - Wolff, C. M.

AU - Prince, J. L.

PY - 1993

Y1 - 1993

N2 - The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing importance with higher circuit integration and system performance. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, CAD framework development and evaluations for performance, manufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system in development, its implementation and applications.

AB - The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing importance with higher circuit integration and system performance. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, CAD framework development and evaluations for performance, manufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system in development, its implementation and applications.

UR - http://www.scopus.com/inward/record.url?scp=0027734739&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0027734739&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027734739

SN - 0780317610

T3 - Midwest Symposium on Circuits and Systems

SP - 847

EP - 850

BT - Midwest Symposium on Circuits and Systems

PB - Publ by IEEE

T2 - Proceedings of the 36th Midwest Symposium on Circuits and Systems

Y2 - 16 August 1993 through 18 August 1993

ER -

Integrated system for design automation of VLSI interconnects and packaging

Abstract

Publication series

Other

ASJC Scopus subject areas

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