TY - JOUR
T1 - Integrated micro-heat-pipe fabrication technology
AU - Lee, Man
AU - Wong, Man
AU - Zohar, Yitshak
N1 - Funding Information:
Manuscript received April 18, 2002; revised November 11, 2002. This work was supported by Hong Kong Research Grant Council through grant HKUST6051/99E. Subject Editor T. Kenny.
PY - 2003/4
Y1 - 2003/4
N2 - This paper presents the design and fabrication of an integrated micro-heat-pipe system consisting of a heater, an array of heat pipes, temperature and capacitive sensors. Taking advantage of the large difference between the dielectric constants of liquid and vapor, the integrated capacitor can be used for void-fraction measurements in two-phase flows. Both CMOS-compatible and glass-based fabrication technologies are reported. In the CMOS-compatible technology, the heat pipes are capped by a thin nitride layer utilizing wafer bonding and etch back technique. In the glass-based technology, the heat pipes are covered by a glass substrate using die-by-die anodic bonding to allow visualization of the two-phase flow patterns. This approach also results in a significant reduction of the parasitic capacitance, thus enhancing the sensitivity of the capacitance sensor. A few particular problems related to this technology are discussed and proper solutions are proposed.
AB - This paper presents the design and fabrication of an integrated micro-heat-pipe system consisting of a heater, an array of heat pipes, temperature and capacitive sensors. Taking advantage of the large difference between the dielectric constants of liquid and vapor, the integrated capacitor can be used for void-fraction measurements in two-phase flows. Both CMOS-compatible and glass-based fabrication technologies are reported. In the CMOS-compatible technology, the heat pipes are capped by a thin nitride layer utilizing wafer bonding and etch back technique. In the glass-based technology, the heat pipes are covered by a glass substrate using die-by-die anodic bonding to allow visualization of the two-phase flow patterns. This approach also results in a significant reduction of the parasitic capacitance, thus enhancing the sensitivity of the capacitance sensor. A few particular problems related to this technology are discussed and proper solutions are proposed.
KW - CMOS-compatible technology
KW - Capacitive microsensors
KW - Glass-based technology
KW - Micro-heat-pipe
KW - Void fraction measurements
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U2 - 10.1109/JMEMS.2003.809955
DO - 10.1109/JMEMS.2003.809955
M3 - Article
AN - SCOPUS:0037387651
SN - 1057-7157
VL - 12
SP - 138
EP - 146
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 2
ER -