Integrated circuit packaging review with an emphasis on 3D packaging

Austin Lancaster, Manish Keswani

Research output: Contribution to journalReview articlepeer-review

54 Scopus citations


An introduction to the exciting and continuously growing topic of IC packaging is presented herein. This review starts with a beginner's level introduction to microelectronic packaging and its essential functions. These functions include environmental protection, mechanical stability, thermal management, and electrical connection. Important methods and process techniques for satisfying these essential functions are included. Knowledge of this material is important to understand the history and advancements of packaging technology. The history is reviewed in the context of technology advancement drivers and how they have ultimately led to 3D packaging. 3D packaging is the modern milestone in packaging technology, and it is described in detail. 3D packaging technology poses many advantageous but there are also serious design challenges to overcome. 3D packaging architecture, advantages, processing, and current challenges become the focus in the second half of this paper.

Original languageEnglish (US)
Pages (from-to)204-212
Number of pages9
JournalIntegration, the VLSI Journal
StatePublished - Jan 2018


  • 3D packaging
  • Chip stacking
  • Integrated circuit packaging
  • Package functions
  • Package processing

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering


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