TY - JOUR
T1 - Increasing the Strength, Hardness, and Survivability of Semiconducting Polymers by Crosslinking
AU - Chen, Alexander X.
AU - Hilgar, Jeremy D.
AU - Samoylov, Anton A.
AU - Pazhankave, Silpa S.
AU - Bunch, Jordan A.
AU - Choudhary, Kartik
AU - Esparza, Guillermo L.
AU - Lim, Allison
AU - Luo, Xuyi
AU - Chen, Hu
AU - Runser, Rory
AU - McCulloch, Iain
AU - Mei, Jianguo
AU - Hoover, Christian
AU - Printz, Adam D.
AU - Romero, Nathan A.
AU - Lipomi, Darren J.
N1 - Funding Information:
This work was supported by the Air Force Office of Scientific Research (AFOSR) grant no. FA9550‐22‐1‐0454. K.C. acknowledges additional support as a Hellman Scholar and an Intel Scholar provided through the Academic Enrichment Program (AEP) at UCSD through the following awards: The Undergraduate Research Scholarship and Semiconductor Research Corporation Scholarship. R.R. acknowledges support from the National Science Foundation Graduate Research Fellowship (NSF GRFP) under grant no. DGE‐1144086. The authors acknowledge the use of facilities and instrumentation supported by NSF through the UC San Diego Materials Research Science and Engineering Center (UCSD MRSEC), grant DMR‐2011924. This work was performed in part at the San Diego Nanotechnology Infrastructure (SDNI) of UCSD, a member of the National Nanotechnology Coordinated Infrastructure, which is supported by the National Science Foundation (Grant ECCS‐2025752). The authors thank the Department of Chemistry and Biochemistry at The University of Arizona for support of the Laboratory for Electron Spectroscopy and Surface Analysis.
Funding Information:
This work was supported by the Air Force Office of Scientific Research (AFOSR) grant no. FA9550-22-1-0454. K.C. acknowledges additional support as a Hellman Scholar and an Intel Scholar provided through the Academic Enrichment Program (AEP) at UCSD through the following awards: The Undergraduate Research Scholarship and Semiconductor Research Corporation Scholarship. R.R. acknowledges support from the National Science Foundation Graduate Research Fellowship (NSF GRFP) under grant no. DGE-1144086. The authors acknowledge the use of facilities and instrumentation supported by NSF through the UC San Diego Materials Research Science and Engineering Center (UCSD MRSEC), grant DMR-2011924. This work was performed in part at the San Diego Nanotechnology Infrastructure (SDNI) of UCSD, a member of the National Nanotechnology Coordinated Infrastructure, which is supported by the National Science Foundation (Grant ECCS-2025752). The authors thank the Department of Chemistry and Biochemistry at The University of Arizona for support of the Laboratory for Electron Spectroscopy and Surface Analysis. [Correction added 26 January 2023, after initial publication: In Figure 6a, the same film image was inadvertently used for the crosslinked and non-crosslinked films at the 5 min interval. This has been replaced so that the correct image now appears for the crosslinked film.]
Publisher Copyright:
© 2022 The Authors. Advanced Materials Interfaces published by Wiley-VCH GmbH.
PY - 2023/1/26
Y1 - 2023/1/26
N2 - Crosslinking is a ubiquitous strategy in polymer engineering to increase the thermomechanical robustness of solid polymers but has been relatively unexplored in the context of π-conjugated (semiconducting) polymers. Notwithstanding, mechanical stability is key to many envisioned applications of organic electronic devices. For example, the wide-scale distribution of photovoltaic devices incorporating conjugated polymers may depend on integration with substrates subject to mechanical insult—for example, road surfaces, flooring tiles, and vehicle paint. Here, a four-armed azide-based crosslinker (“4Bx”) is used to modify the mechanical properties of a library of semiconducting polymers. Three polymers used in bulk heterojunction solar cells (donors J51 and PTB7-Th, and acceptor N2200) are selected for detailed investigation. In doing so, it is shown that low loadings of 4Bx can be used to increase the strength (up to 30%), toughness (up to 75%), hardness (up to 25%), and cohesion of crosslinked films. Likewise, crosslinked films show greater physical stability in comparison to non-crosslinked counterparts (20% vs 90% volume lost after sonication). Finally, the locked-in morphologies and increased mechanical robustness enable crosslinked solar cells to have greater survivability to four degradation tests: abrasion (using a sponge), direct exposure to chloroform, thermal aging, and accelerated degradation (heat, moisture, and oxygen).
AB - Crosslinking is a ubiquitous strategy in polymer engineering to increase the thermomechanical robustness of solid polymers but has been relatively unexplored in the context of π-conjugated (semiconducting) polymers. Notwithstanding, mechanical stability is key to many envisioned applications of organic electronic devices. For example, the wide-scale distribution of photovoltaic devices incorporating conjugated polymers may depend on integration with substrates subject to mechanical insult—for example, road surfaces, flooring tiles, and vehicle paint. Here, a four-armed azide-based crosslinker (“4Bx”) is used to modify the mechanical properties of a library of semiconducting polymers. Three polymers used in bulk heterojunction solar cells (donors J51 and PTB7-Th, and acceptor N2200) are selected for detailed investigation. In doing so, it is shown that low loadings of 4Bx can be used to increase the strength (up to 30%), toughness (up to 75%), hardness (up to 25%), and cohesion of crosslinked films. Likewise, crosslinked films show greater physical stability in comparison to non-crosslinked counterparts (20% vs 90% volume lost after sonication). Finally, the locked-in morphologies and increased mechanical robustness enable crosslinked solar cells to have greater survivability to four degradation tests: abrasion (using a sponge), direct exposure to chloroform, thermal aging, and accelerated degradation (heat, moisture, and oxygen).
KW - crosslinking
KW - mechanical properties
KW - photovoltaics
KW - polymer coatings
KW - semiconducting polymers
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U2 - 10.1002/admi.202202053
DO - 10.1002/admi.202202053
M3 - Article
AN - SCOPUS:85143395484
SN - 2196-7350
VL - 10
JO - Advanced Materials Interfaces
JF - Advanced Materials Interfaces
IS - 3
M1 - 2202053
ER -