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Improving dnn fault tolerance using weight pruning and differential crossbar mapping for reram-based edge ai

  • Geng Yuan
  • , Zhiheng Liao
  • , Xiaolong Ma
  • , Yuxuan Cai
  • , Zhenglun Kong
  • , Xuan Shen
  • , Jingyan Fu
  • , Zhengang Li
  • , Chengming Zhang
  • , Hongwu Peng
  • , Ning Liu
  • , Ao Ren
  • , Jinhui Wang
  • , Yanzhi Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recent research demonstrated the promise of using resistive random access memory (ReRAM) as an emerging technology to perform inherently parallel analog domain in-situ matrix-vector multiplication - the intensive and key computation in deep neural networks (DNNs). However, hardware failure, such as stuck-at-fault defects, is one of the main concerns that impedes the ReRAM devices to be a feasible solution for real implementations. The existing solutions to address this issue usually require an optimization to be conducted for each individual device, which is impractical for mass-produced products (e.g., IoT devices). In this paper, we rethink the value of weight pruning in ReRAM-based DNN design from the perspective of model fault tolerance. And a differential mapping scheme is proposed to improve the fault tolerance under a high stuck-on fault rate. Our method can tolerate almost an order of magnitude higher failure rate than the traditional two-column method in representative DNN tasks. More importantly, our method does not require extra hardware cost compared to the traditional two-column mapping scheme. The improvement is universal and does not require the optimization process for each individual device.

Original languageEnglish (US)
Title of host publicationProceedings of the 22nd International Symposium on Quality Electronic Design, ISQED 2021
PublisherIEEE Computer Society
Pages135-141
Number of pages7
ISBN (Electronic)9781728176413
DOIs
StatePublished - Apr 7 2021
Externally publishedYes
Event22nd International Symposium on Quality Electronic Design, ISQED 2021 - Santa Clara, United States
Duration: Apr 7 2021Apr 9 2021

Publication series

NameProceedings - International Symposium on Quality Electronic Design, ISQED
Volume2021-April
ISSN (Print)1948-3287
ISSN (Electronic)1948-3295

Conference

Conference22nd International Symposium on Quality Electronic Design, ISQED 2021
Country/TerritoryUnited States
CitySanta Clara
Period4/7/214/9/21

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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