TY - GEN
T1 - Implementation of apertures in a MoM-based simulator for stripline packaging problems
AU - Cao, Yi
AU - Wang, Xing
AU - Nielson, Derek
AU - Dvorak, Steven L.
PY - 2007
Y1 - 2007
N2 - An integral-equation-based, Full-Wave Layered Interconnect Simulator (UA-FWLIS) has recently been developed for the simulation of stripline interconnects. In this paper we extend UA-FWLIS so that it can handle apertures in the power/ground planes. Apertures are often cut in power/ground planes to help reduce the effects of the digital noise on the more sensitive analog circuitry. In order to account for the effects of the apertures, we use the field equivalence theorem to define equivalent magnetic currents that flow in the apertures. These magnetic currents interrupt the flow of the electrical currents on the power/ground planes, and they also allow for coupling between traces in adjacent layers in multi-layer stripline structures.
AB - An integral-equation-based, Full-Wave Layered Interconnect Simulator (UA-FWLIS) has recently been developed for the simulation of stripline interconnects. In this paper we extend UA-FWLIS so that it can handle apertures in the power/ground planes. Apertures are often cut in power/ground planes to help reduce the effects of the digital noise on the more sensitive analog circuitry. In order to account for the effects of the apertures, we use the field equivalence theorem to define equivalent magnetic currents that flow in the apertures. These magnetic currents interrupt the flow of the electrical currents on the power/ground planes, and they also allow for coupling between traces in adjacent layers in multi-layer stripline structures.
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U2 - 10.1109/ECTC.2007.374014
DO - 10.1109/ECTC.2007.374014
M3 - Conference contribution
AN - SCOPUS:35348877160
SN - 1424409853
SN - 9781424409853
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1638
EP - 1645
BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07
Y2 - 29 May 2007 through 1 June 2007
ER -