Impact of wall region particle volume fraction distribution on thermal resistance of particle filled thermal interface materials

Xuejiao Hu, Linan Jiang, Kenneth E. Goodson

Research output: Contribution to journalConference articlepeer-review

3 Scopus citations

Abstract

Increasing chip power densities require thermal interface materials (TIMs) with lower thermal resistance. The thermal resistance of particle-filled polymer-based TIMs is measured using a high-resolution cross-sectional IR imaging technique, and simulated using a finite volume technique and a closed-form model. It is found that the TIM thermal resistance is strongly influenced by the change in particle volume fraction near the TIM-chip and TIM-spreader boundaries, which yields an effective thermal boundary resistance near the TIM-wall boundaries. This effective boundary resistance increases with increasing filled panicle size, increasing ratio of particle to matrix thermal conductivity and decreasing TIM thickness. These findings are valuable to achieve better TIM thermal performance.

Original languageEnglish (US)
Pages (from-to)106-111
Number of pages6
JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
StatePublished - 2003
Externally publishedYes
EventNineteents Annual IEEE Semiconductor Thermal Measurement And Management Symposium - San Jose, CA, United States
Duration: Mar 11 2003Mar 13 2003

Keywords

  • Electronic packaging
  • Heat conduction
  • Infrared microscopy
  • Particle-filled polymer composite
  • Thermal interface material (TIM)

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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