@inproceedings{3e0d6c6fbbe9480680d9aae8b7f223cb,
title = "Impact of geometry of embedded pattern layer on signal integrity of coupled microstrips",
abstract = "In this paper, the interconnect performance of closely spaced microstrip lines with embedded patterned layers (EPL) are presented. The EPL is an added patterned layer of printed sub wavelength elements that is placed between the ground and signal layers of the microstrip. A comparison of the performance of the microstrips with various EPL geometries is conducted. A study of the pattern density and the shape of the EPL patterns on insertion loss, return loss, and far-end cross talk (FEXT) is provided. The purpose of this work is to evaluate how the EPL geometry can be optimized to improve signal integrity in tightly spaced interconnects.",
keywords = "Crosstalk, insertion loss, interconnects, microstrip",
author = "Vargas, {Marcos A.} and Melde, {Kathleen L.}",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 ; Conference date: 26-10-2014 Through 29-10-2014",
year = "2014",
doi = "10.1109/EPEPS.2014.7103611",
language = "English (US)",
series = "2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "121--124",
booktitle = "2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014",
}