Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

Selda Oterkus; Erdogan Madenci; Erkan Oterkus; Yuchul Hwang; Jangyong Bae; Sungwon Han

doi:10.1109/ECTC.2014.6897407

Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

Selda Oterkus, Erdogan Madenci, Erkan Oterkus, Yuchul Hwang, Jangyong Bae, Sungwon Han

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

45 Scopus citations

Abstract

This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.

Original language	English (US)
Title of host publication	Proceedings - Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	973-982
Number of pages	10
ISBN (Electronic)	9781479924073
DOIs	https://doi.org/10.1109/ECTC.2014.6897407
State	Published - Sep 11 2014
Event	64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States Duration: May 27 2014 → May 30 2014

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	64th Electronic Components and Technology Conference, ECTC 2014
Country/Territory	United States
City	Orlando
Period	5/27/14 → 5/30/14

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2014.6897407

Cite this

Oterkus, S., Madenci, E., Oterkus, E., Hwang, Y., Bae, J., & Han, S. (2014). Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. In Proceedings - Electronic Components and Technology Conference (pp. 973-982). [6897407] (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2014.6897407

Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. / Oterkus, Selda; Madenci, Erdogan; Oterkus, Erkan et al.
Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2014. p. 973-982 6897407 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Oterkus, S, Madenci, E, Oterkus, E, Hwang, Y, Bae, J & Han, S 2014, Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. in Proceedings - Electronic Components and Technology Conference., 6897407, Proceedings - Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers Inc., pp. 973-982, 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United States, 5/27/14. https://doi.org/10.1109/ECTC.2014.6897407

Oterkus S, Madenci E, Oterkus E, Hwang Y, Bae J, Han S. Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics. In Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2014. p. 973-982. 6897407. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2014.6897407

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Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics

Abstract

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