TY - GEN
T1 - Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics
AU - Oterkus, Selda
AU - Madenci, Erdogan
AU - Oterkus, Erkan
AU - Hwang, Yuchul
AU - Bae, Jangyong
AU - Han, Sungwon
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/9/11
Y1 - 2014/9/11
N2 - This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.
AB - This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits the specification of distinct properties of interfaces between dissimilar materials in the direct modeling of thermal and moisture diffusion, and deformation. Therefore, it enables progressive damage analysis in materials or layered material systems such as the electronic packages. It describes the validation procedure by considering a particular package for each thermomechanical, hygromechanical deformation as well as vapor pressure predictions. Also, it presents results concerning failure sites and mechanisms due to hygro-thermo-vapor-deformation.
UR - http://www.scopus.com/inward/record.url?scp=84907891722&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84907891722&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2014.6897407
DO - 10.1109/ECTC.2014.6897407
M3 - Conference contribution
AN - SCOPUS:84907891722
T3 - Proceedings - Electronic Components and Technology Conference
SP - 973
EP - 982
BT - Proceedings - Electronic Components and Technology Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 64th Electronic Components and Technology Conference, ECTC 2014
Y2 - 27 May 2014 through 30 May 2014
ER -