Heat transfer in a microchannel flow [substrate cooling]

W. K.H. Chu; U. T. Hsu; M. Wong; Y. Zohar

doi:10.1109/HKEDM.1994.395134

Heat transfer in a microchannel flow [substrate cooling]

W. K.H. Chu, U. T. Hsu, M. Wong, Y. Zohar

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Scopus citations

Abstract

The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented.

Original language	English (US)
Title of host publication	Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	38-43
Number of pages	6
ISBN (Electronic)	0780320867, 9780780320864
DOIs	https://doi.org/10.1109/HKEDM.1994.395134
State	Published - 1994
Externally published	Yes
Event	1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994 - Hong Kong, Hong Kong Duration: Jul 18 1994 → …

Publication series

Name	Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994

Conference

Conference	1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994
Country/Territory	Hong Kong
City	Hong Kong
Period	7/18/94 → …

ASJC Scopus subject areas

Electrical and Electronic Engineering
Instrumentation

Access to Document

10.1109/HKEDM.1994.395134

Cite this

Chu, W. K. H., Hsu, U. T., Wong, M., & Zohar, Y. (1994). Heat transfer in a microchannel flow [substrate cooling]. In Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994 (pp. 38-43). Article 395134 (Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/HKEDM.1994.395134

Heat transfer in a microchannel flow [substrate cooling]. / Chu, W. K.H.; Hsu, U. T.; Wong, M. et al.
Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994. Institute of Electrical and Electronics Engineers Inc., 1994. p. 38-43 395134 (Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Chu, WKH, Hsu, UT, Wong, M & Zohar, Y 1994, Heat transfer in a microchannel flow [substrate cooling]. in Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994., 395134, Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994, Institute of Electrical and Electronics Engineers Inc., pp. 38-43, 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994, Hong Kong, Hong Kong, 7/18/94. https://doi.org/10.1109/HKEDM.1994.395134

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author = "Chu, {W. K.H.} and Hsu, {U. T.} and M. Wong and Y. Zohar",

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year = "1994",

doi = "10.1109/HKEDM.1994.395134",

language = "English (US)",

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AB - The field of MicroElectroMechanical Systems (MEMS) is expanding rapidly. It is becoming feasible to integrate complete microsystems by merging mechanical, electrical, thermal, optical and perhaps chemical components. Utilizing surface micromachining techniques, a large number of small-size, high-precision channels can be constructed as part of microcooling systems. The experimental setup proposed for the study of heat transfer characteristics of such microchannel flow is described in the first part of the paper. In the second part, initial results of a theoretical investigation of heat removal from a substrate by microchannel flow are presented.

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BT - Proceedings - 1994 IEEE Hong Kong Electron Devices Meeting, HKEDM 1994

PB - Institute of Electrical and Electronics Engineers Inc.

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ER -

Heat transfer in a microchannel flow [substrate cooling]

Abstract

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ASJC Scopus subject areas

Access to Document

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