Heat induced damage detection in composite materials by terahertz radiation

Maciej Radzieński, Mieloszyk Magdalena, Ehsan Kabiri Rahani, Tribikram Kundu, Wiesław Ostachowicz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

In recent years electromagnetic Terahertz (THz) radiation or T-ray has been increasingly used for nondestructive evaluation of various materials such as polymer composites and porous foam tiles in which ultrasonic waves cannot penetrate but T-ray can. Most of these investigations have been limited to mechanical damage detection like inclusions, cracks, delaminations etc. So far only a few investigations have been reported on heat induced damage detection. Unlike mechanical damage the heat induced damage does not have a clear interface between the damaged part and the surrounding intact material from which electromagnetic waves can be reflected back. Difficulties aßociated with the heat induced damage detection in composite materials using T-ray are discußed in detail in this paper. T-ray measurements are compared for different levels of heat exposure of composite specimens.

Original languageEnglish (US)
Title of host publicationHealth Monitoring of Structural and Biological Systems 2015
EditorsTribikram Kundu
PublisherSPIE
ISBN (Electronic)9781628415414
DOIs
StatePublished - 2015
EventHealth Monitoring of Structural and Biological Systems 2015 - San Diego, United States
Duration: Mar 9 2015Mar 12 2015

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9438
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

OtherHealth Monitoring of Structural and Biological Systems 2015
Country/TerritoryUnited States
CitySan Diego
Period3/9/153/12/15

Keywords

  • T-ray
  • Terahertz radiation
  • Thermal degradation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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