TY - GEN
T1 - Handling partial correlations in yield prediction
AU - Varadan, Sridhar
AU - Wang, Janet
AU - Hu, Jiang
PY - 2008
Y1 - 2008
N2 - In nanometer regime, IC designs have to consider the impact of process variations, which is often indicated by manufacturing/parametric yield. This paper investigates a yield model - the probability that the values of multiple manufacturing/circuit parameters meet certain target. This model can be applied to predict CMP (Chemical-Mechanical Planarization) yield. We focus on the difficult cases which have large number of partially correlated variations. In order to predict the yield for these difficult cases efficiently, we propose two techniques: (1) application of Orthogonal Principle Component Analysis (OPCA); (2) hierarchical adaptive quadrisection (HAQ). Systematic variations are also included in our model. Compared to previous work, the OPCA based method can reduce the error on yield estimation from 17.1%-21.1% to 1.3%-2.8% with 4.6 × speedup. The HAQ technique can reduce the error to 4.1% - 5.6% with 6 × -9.4 × speedup.
AB - In nanometer regime, IC designs have to consider the impact of process variations, which is often indicated by manufacturing/parametric yield. This paper investigates a yield model - the probability that the values of multiple manufacturing/circuit parameters meet certain target. This model can be applied to predict CMP (Chemical-Mechanical Planarization) yield. We focus on the difficult cases which have large number of partially correlated variations. In order to predict the yield for these difficult cases efficiently, we propose two techniques: (1) application of Orthogonal Principle Component Analysis (OPCA); (2) hierarchical adaptive quadrisection (HAQ). Systematic variations are also included in our model. Compared to previous work, the OPCA based method can reduce the error on yield estimation from 17.1%-21.1% to 1.3%-2.8% with 4.6 × speedup. The HAQ technique can reduce the error to 4.1% - 5.6% with 6 × -9.4 × speedup.
UR - http://www.scopus.com/inward/record.url?scp=49549093578&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=49549093578&partnerID=8YFLogxK
U2 - 10.1109/ASPDAC.2008.4484010
DO - 10.1109/ASPDAC.2008.4484010
M3 - Conference contribution
AN - SCOPUS:49549093578
SN - 9781424419227
T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
SP - 543
EP - 548
BT - 2008 Asia and South Pacific Design Automation Conference, ASP-DAC
T2 - 2008 Asia and South Pacific Design Automation Conference, ASP-DAC
Y2 - 21 March 2008 through 24 March 2008
ER -