Guided waves for monitoring heat treatment duration and material hardness

Nilesh Korde, Tribikram Kundu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Elastic properties of materials can be easily determined from the ultrasonic wave velocity measurement. However, material hardness cannot be obtained from the ultrasonic wave speed. Heat treatment and aging affect the microstructure of materials changing their hardness and strength. In this study it is investigated how the attenuation of ultrasonic guided waves is affected by the duration of heat treatment and varying material hardness. To this aim six identical Aluminum 2024 alloy plate specimens were subjected to different durations of heat treatment at 150oC and were inspected nondestructively propagating Lamb waves through the specimens. Attenuation of the Lamb wave was found to be inversely related to the hardness. Rockwell Hardness test was performed to corroborate the ultrasonic observations. In comparison to Rockwell hardness test the ultrasonic inspection was found to be more sensitive to the heat treatment duration. From these results it is concluded that guided wave inspection method is a reliable and probably more desirable alternative for characterizing the hardness of heat treated materials.

Original languageEnglish (US)
Title of host publicationHealth Monitoring of Structural and Biological Systems 2012
DOIs
StatePublished - 2012
EventHealth Monitoring of Structural and Biological Systems 2012 - San Diego, CA, United States
Duration: Mar 12 2012Mar 15 2012

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8348
ISSN (Print)0277-786X

Other

OtherHealth Monitoring of Structural and Biological Systems 2012
Country/TerritoryUnited States
CitySan Diego, CA
Period3/12/123/15/12

Keywords

  • Heat treatment
  • Lamb wave
  • Material characterization
  • Material hardness
  • Rockwell hardness
  • Wave attenuation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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