Abstract
The global/local finite element method was extended to include elastic and/or plastic deformation. A global element stiffness matrix was constructed based on the analytical solution for a singular stress field near a junction of dissimilar materials with elastic and elastic-plastic behaviors. It was found that considering only the order of the singularity in predicting the failure site is not sufficient.
Original language | English (US) |
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Pages (from-to) | 987-993 |
Number of pages | 7 |
Journal | Proceedings - Electronic Components and Technology Conference |
State | Published - 1999 |
Event | Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA Duration: Jun 1 1999 → Jun 4 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering