TY - GEN
T1 - GaP-on-insulator as a platform for integrated photonics
AU - Hönl, Simon
AU - Schneider, Katharina
AU - Welter, Pol
AU - Baumgartner, Yannick
AU - Hahn, Herwig
AU - Czornomaz, Lukas
AU - Wilson, Dalziel J.
AU - Seidler, Paul
N1 - Publisher Copyright:
© OSA 2018.
PY - 2018
Y1 - 2018
N2 - We present a complete process flow for fabrication of integrated GaP-on-insulator photonic devices via direct wafer bonding of epitaxial films. High-fidelity patterning enables a range of applications, such as waveguide resonators and photonic crystal cavities.
AB - We present a complete process flow for fabrication of integrated GaP-on-insulator photonic devices via direct wafer bonding of epitaxial films. High-fidelity patterning enables a range of applications, such as waveguide resonators and photonic crystal cavities.
UR - http://www.scopus.com/inward/record.url?scp=85048991719&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85048991719&partnerID=8YFLogxK
U2 - 10.1364/CLEO_SI.2018.STh3I.6
DO - 10.1364/CLEO_SI.2018.STh3I.6
M3 - Conference contribution
AN - SCOPUS:85048991719
SN - 9781943580422
T3 - Optics InfoBase Conference Papers
BT - CLEO
PB - Optica Publishing Group (formerly OSA)
T2 - CLEO: Science and Innovations, CLEO_SI 2018
Y2 - 13 May 2018 through 18 May 2018
ER -