TY - GEN
T1 - Fundamentals of wafer rinse processes and the interactions with water conservation and recycling in semiconductor manufacturing plants
AU - Shadman, F.
AU - Seif, D.
AU - Peterson, T.
N1 - Publisher Copyright:
© (2001) Trans Tech Publications, Switzerland.
PY - 2001
Y1 - 2001
N2 - Production and distribution of ultra-pure water (UPW) in semiconductor manufacturing plants has significant environmental and economic impact. Most of the UPW is used for wafer rinsing. In recent years two strategies have been used to lower water usage in fabs: one is the minimization of rinse water usage by more efficient rinse tools and techniques; the other is the reuse and/or recycle of water recovered from various applications, particularly from the final stages of rinse. The implementation of these methods with minimum contamination risk requires better understanding of the fundamentals of the rinse process, the dynamics of the rate limiting step(s), and the interactions between rinse and recycle.
AB - Production and distribution of ultra-pure water (UPW) in semiconductor manufacturing plants has significant environmental and economic impact. Most of the UPW is used for wafer rinsing. In recent years two strategies have been used to lower water usage in fabs: one is the minimization of rinse water usage by more efficient rinse tools and techniques; the other is the reuse and/or recycle of water recovered from various applications, particularly from the final stages of rinse. The implementation of these methods with minimum contamination risk requires better understanding of the fundamentals of the rinse process, the dynamics of the rate limiting step(s), and the interactions between rinse and recycle.
UR - http://www.scopus.com/inward/record.url?scp=26644457941&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=26644457941&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/SSP.76-77.189
DO - 10.4028/www.scientific.net/SSP.76-77.189
M3 - Conference contribution
AN - SCOPUS:26644457941
SN - 9783908450573
T3 - Solid State Phenomena
SP - 189
EP - 190
BT - Ultra Clean Processing of Silicon Surfaces 2000
A2 - Heyns, Marc
A2 - Mertens, Paul
A2 - Meuris, Marc
PB - Trans Tech Publications Ltd
T2 - 5th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 2000
Y2 - 18 September 2000 through 20 September 2000
ER -