Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications

A. Philipossian; T. Sun

doi:10.1149/1.3058994

Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications

A. Philipossian, T. Sun

Chemical and Environmental Engineering

Research output: Contribution to journal › Article › peer-review

19 Scopus citations

Abstract

Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.

Original language	English (US)
Pages (from-to)	H84-H87
Journal	Electrochemical and Solid-State Letters
Volume	12
Issue number	3
DOIs	https://doi.org/10.1149/1.3058994
State	Published - 2009

ASJC Scopus subject areas

Chemical Engineering(all)
Materials Science(all)
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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10.1149/1.3058994

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abstract = "Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.",

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AB - Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.

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Frictional analysis of various poly(vinyl alcohol) brush roller designs for post-interlevel dielectric cmp scrubbing applications

Abstract

ASJC Scopus subject areas

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