Formation of nanoporous Au by dealloying AuCu thin films in HNO3

R. Morrish; K. Dorame; A. J. Muscat

doi:10.1016/j.scriptamat.2011.01.021

Formation of nanoporous Au by dealloying AuCu thin films in HNO₃

R. Morrish, K. Dorame, A. J. Muscat

Research output: Contribution to journal › Article › peer-review

74 Scopus citations

Abstract

AuCu thin films were dealloyed in concentrated HNO₃ solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol^-1, which is less than half that reported for AgAu alloys.

Original language	English (US)
Pages (from-to)	856-859
Number of pages	4
Journal	Scripta Materialia
Volume	64
Issue number	9
DOIs	https://doi.org/10.1016/j.scriptamat.2011.01.021
State	Published - May 2011
Externally published	Yes

Keywords

Dealloy
Nanostructured material
Porous material
Surface diffusion
Thin films

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Access to Document

10.1016/j.scriptamat.2011.01.021

Cite this

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title = "Formation of nanoporous Au by dealloying AuCu thin films in HNO3",

abstract = "AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol-1, which is less than half that reported for AgAu alloys.",

keywords = "Dealloy, Nanostructured material, Porous material, Surface diffusion, Thin films",

author = "R. Morrish and K. Dorame and Muscat, {A. J.}",

note = "Funding Information: R.M. gratefully acknowledges support from the American Association of University Women (AAUW) Selected Professions Fellowship, the Achievement Rewards for College Scientists (ARCS) Foundation and the University of Arizona Chapman Fellowship . K.D. acknowledges support from the University of Arizona Honors College Undergraduate Research Scholarship . We are grateful to Philip Anderson (Department of Material Science, University of Arizona) for collecting the XRD data.",

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AU - Morrish, R.

AU - Dorame, K.

AU - Muscat, A. J.

N1 - Funding Information: R.M. gratefully acknowledges support from the American Association of University Women (AAUW) Selected Professions Fellowship, the Achievement Rewards for College Scientists (ARCS) Foundation and the University of Arizona Chapman Fellowship . K.D. acknowledges support from the University of Arizona Honors College Undergraduate Research Scholarship . We are grateful to Philip Anderson (Department of Material Science, University of Arizona) for collecting the XRD data.

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N2 - AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol-1, which is less than half that reported for AgAu alloys.

AB - AuCu thin films were dealloyed in concentrated HNO3 solution at temperatures of 5-35 °C. X-ray diffraction and scanning electron microscopy analysis showed that interior grain regions undergo partial Cu dissolution before being assimilated into a ligament/void network that was initiated at grain boundaries. The compressive stress generated by removal of the smaller Cu atom yielded an activation energy for ligament growth of 25.4 ± 2.37 kJ mol-1, which is less than half that reported for AgAu alloys.

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KW - Surface diffusion

KW - Thin films

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