@article{24cd0df213f245c18ea5a54c4410938c,
title = "Foreword - Contributions from thermal challenges in next generation electronic systems (THERMES)",
author = "Garimella, \{Suresh V.\} and Joshi, \{Yogendra K.\}",
year = "2002",
month = dec,
doi = "10.1109/TCAPT.2002.807992",
language = "English (US)",
volume = "25",
pages = "567--568",
journal = "IEEE Transactions on Components and Packaging Technologies",
issn = "1521-3331",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",
}